Graphene NEMS

We are aiming to achieve state-of-the-art graphene NEMS devices and explore fundamental physics and new engineering in suspended graphene devices, e.g., very board frequency tuning range, ultra-high frequency, and superior Q factors.
       
 
  Black Phosphorus NEMS

We are developing 2D black phosphorus (P) NEMS resonators with novel sensing schemes (e.g., IR sensing). We have already demonstrated all-electrical transduction of black P NEMS resonator for future on-chip integrated optical sensor. We are also studying the polarization sensitive nature of black P NEMS resonator, which can generate new exciting applications.
       
 
 Two-Dimensional (2D) Heterostructure NEMS

By fabricating 2D suspended heterostructure devices, we are aiming to explore the thermal, mechanical and electrical transport properties in this novel platform. 
    
 
  Ultra-Wide-Bandgap (UWBG) Resonant MEMS/NEMS

UWBG materials possess outstanding mechanical properties and environmental inertness favorable for MEMS/NEMS.  We are aiming to develop nanomechanical devices using UWBG materials, e.g., h-BN and β-Ga2O3, providing essential platforms for resonant sensing and signal processing in harsh environments.  
       
 
  Energy Dissipations in Wide Bandgap (WBG) MEMS/NEMS

The limited understanding in energy dissipations of WBG material MEMS/NEMS devices has restricted their excellent potential.  We are aiming to investigate the energy dissipations in AlN and SiC resonant devices for a comprehensive mapping of their loss mechanisms.  
       
 
 Optomechanical Coupling in Solid State Emitters

We are aiming to explore the interaction between mechanical vibrations and photon excitation states in solid state materials (including diamond, silicon carbide, and atomic layered materials), and develop strain-engineered devices towards quantum optomechanical applications.
    
 

 Self-Powering Wireless Sensor Node

We are aiming to develop a self-powering wireless sensor node technology for future IoT applications.  It implements piezoelectric energy harvesters to convert vibration energy into electricity, and an ultra-low-power power management circuit to regulate power for on-chip temperature sensor.  Data sensed will be transmitted wirelessly through an ultralow power transmission protocol, e.g., Zigbee.